Compound Resin
Grade | MFR (g/10min) | Density (g/cm3) | Application |
C1803PJ-04 | 7 | 1.04 | Automotive |
C1809PJ-02 | 5 | 1.33 | Electronic & Housing |
C2025PH-08 | 1.95 | 0.896 | Cap & Closure |
C2025PH-09 | 1.95 | 0.895 | Cap & Closure |
C2106EC-01 | 7.7 | 0.93 | Cap & Closure |
HD00108WBK | 0.16 | 0.958 | Wire & Cable |
HD00407B | 0.45 | 1.54 | Flexible Packaging, Masterbatch |
HD8100MB | 0.25 | 0.960 | Pipe |
HD8181MB | 0.30 | 0.960 | Pipe |
LL16006W | 16 | 1.47 | Wire & Cable |
LL20001JBK | 20 | 0.92 | Automotive |
LL70600 | 0.6 | 0.923 | Flexible Packaging |
MD00801WBK | 0.8 | 0.948 | Wire & Cable |
PB04003F | 4.0 | 1.53 | Bio |
PB05001F | 5 | 1.26 | Bio |
PC15007JBK | 15 | 1.14 | Automotive |
PC20006JBK | 17 | 1.13 | Automotive |
PC20006JGY | 16 | 1.13 | Automotive |
PL03404J | 3.4 | 1.31 | Bio |
PL04005E | 3.5 | 1.31 | Bio |
PL04006E | 3.5 | 1.31 | Bio |
PL34002J | 30 | 1.26 | Bio |
PP07605JBK | 8 | 0.91 | Automotive |
PP11001J | 11 | 0.91 | Automotive |
PP25027JGY | 25 | 1.07 | Automotive |
S908C | 2.2 | 1.11 | Electronic & Housing |